With the new metallic frame, solid encapsulation and new superior hard protective coating FPC now enhances the quality standards of CMOS sensors.  The FPC1011F still utilizes the FPC patented 3D pixel sensing technology, which gives outstanding image quality for virtually any finger. 

Parallel to the launch of the new FPC1011F sensor, FPC also launches the small, fast and easy to integrate biometric module FPC-AM3.  It is based on the new FPC1011F sensor and the small, fast and power efficient processor ASIC FPC2020.